Description
Copper sputtering targets for physical vapour deposition and magnetron sputtering workflows. Select a standard diameter and thickness, or request a specification tailored to your deposition system.
Material grade, purity, tolerances, surface finish and other technical requirements are confirmed during quotation.
Additional Information
| Atomic Mass | 63.546 g/mol |
|---|---|
| CAS Number | 7440-50-8 |
| Chemical Formula | Cu |
| Morphology | Solid sputtering target |
| Pack Size | 1 piece |
| Purity | 99.99% (4N) |
| Brand | NANOCORPS |
| Country of Origin | India |
| Target Diameter | 1 inch (25.4 mm) |
| Thickness | 1 mm |
| Target Configuration | Unbonded |
| SKU | SPT-CU |
Applications
- Physical vapour deposition and magnetron sputtering
- Conductive interconnects
- Seed layers for electroplating
- Electronic and thermal-management films
