Utilized in thermal management substrates for power electronics and high-brightness LEDs with thermal conductivity (170-230 W/m·K) matching copper while providing electrical insulation, piezoelectric devices for surface acoustic wave (SAW) filters in 5G telecommunications, ceramic substrates for hybrid integrated circuits requiring heat dissipation, packaging materials for RF power amplifiers and microwave devices, crucibles and boats for semiconductor crystal growth providing chemical inertness, dielectric layers in electronic packaging with low dielectric constant, refractory materials for high-temperature furnaces and molten metal handling, neutron detectors for nuclear instrumentation when enriched with ¹³C, thermal interface materials for CPU and GPU cooling, and sintering aids for advanced ceramics. AlN combines high thermal conductivity with electrical insulation, making it ideal for thermal management in high-power electronics.