Additional information
| Cas number | 7440-50-8 |
|---|---|
| Empirical formula | Cu |
| Atomic mass | 63.546 |
| Average particle size | ~25 nm |
| Purity | >99% |
| Appearance | Saddle Brown Powder |
| Morphology | Spherical |
| Bulk density | 0.15 – 0.35 g/cm1 |
Copper Nanoparticles (Co), ~25 nm, >99%
“Acts as an anti-biotic, anti-microbial, and anti-fungal agent when added to plastics, coatings, and textiles
Copper diet supplements with efficient delivery characteristics
High strength metals and alloys
EMI shielding
Heat sinks and highly thermal conductive materials
Efficient catalyst for chemical reactions and for the synthesis of methanol and glycol
As sintering additives and capacitor materials
Conductive inks and pastes containing Cu Nanoparticless can be used as a substitute for very expensive noble metals used in printed electronics, displays, and transmissive conductive thin film applications
Superficial conductive coating processing of metal and non-ferrous metal
Production of MLCC internal electrode and other electronic components in electronic slurry for the miniaturization of microelectronic devices;
As nanometal lubricant additives”.
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Copper Nanoparticles (Co), ~50 nm, >99%
Read moreCopper Nanoparticles (Co), ~50 nm, >99%
“Acts as an anti-biotic, anti-microbial, and anti-fungal agent when added to plastics, coatings, and textiles
Copper diet supplements with efficient delivery characteristics
High strength metals and alloys
EMI shielding
Heat sinks and highly thermal conductive materials
Efficient catalyst for chemical reactions and for the synthesis of methanol and glycol
As sintering additives and capacitor materials
Conductive inks and pastes containing Cu Nanoparticless can be used as a substitute for very expensive noble metals used in printed electronics, displays, and transmissive conductive thin film applications
Superficial conductive coating processing of metal and non-ferrous metal
Production of MLCC internal electrode and other electronic components in electronic slurry for the miniaturization of microelectronic devices;
As nanometal lubricant additives”. -
Copper Nanoparticles (Co), >99%
Read moreCopper Nanoparticles (Co), >99%
“Acts as an anti-biotic, anti-microbial, and anti-fungal agent when added to plastics, coatings, and textiles
Copper diet supplements with efficient delivery characteristics
High strength metals and alloys
EMI shielding
Heat sinks and highly thermal conductive materials
Efficient catalyst for chemical reactions and for the synthesis of methanol and glycol
As sintering additives and capacitor materials
Conductive inks and pastes containing Cu Nanoparticless can be used as a substitute for very expensive noble metals used in printed electronics, displays, and transmissive conductive thin film applications
Superficial conductive coating processing of metal and non-ferrous metal
Production of MLCC internal electrode and other electronic components in electronic slurry for the miniaturization of microelectronic devices;
As nanometal lubricant additives”.
